JPH03106740U - - Google Patents
Info
- Publication number
- JPH03106740U JPH03106740U JP11154890U JP11154890U JPH03106740U JP H03106740 U JPH03106740 U JP H03106740U JP 11154890 U JP11154890 U JP 11154890U JP 11154890 U JP11154890 U JP 11154890U JP H03106740 U JPH03106740 U JP H03106740U
- Authority
- JP
- Japan
- Prior art keywords
- film
- device mounting
- semiconductor device
- mounting portion
- semiconductor chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 15
- 239000011347 resin Substances 0.000 claims 2
- 229920005989 resin Polymers 0.000 claims 2
- 239000003822 epoxy resin Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11154890U JPH03106740U (en]) | 1989-12-01 | 1990-10-24 |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13956089 | 1989-12-01 | ||
| JP11154890U JPH03106740U (en]) | 1989-12-01 | 1990-10-24 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03106740U true JPH03106740U (en]) | 1991-11-05 |
Family
ID=31890337
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11154890U Pending JPH03106740U (en]) | 1989-12-01 | 1990-10-24 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03106740U (en]) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5158066A (en]) * | 1974-11-15 | 1976-05-21 | Nippon Electric Co | |
| JPS5890752A (ja) * | 1981-11-25 | 1983-05-30 | Nec Corp | 半導体装置の製造方法 |
| JPS6246537A (ja) * | 1985-08-23 | 1987-02-28 | Nec Corp | フィルムキャリヤ半導体装置の電気試験方法 |
-
1990
- 1990-10-24 JP JP11154890U patent/JPH03106740U/ja active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5158066A (en]) * | 1974-11-15 | 1976-05-21 | Nippon Electric Co | |
| JPS5890752A (ja) * | 1981-11-25 | 1983-05-30 | Nec Corp | 半導体装置の製造方法 |
| JPS6246537A (ja) * | 1985-08-23 | 1987-02-28 | Nec Corp | フィルムキャリヤ半導体装置の電気試験方法 |